Broadcom Corporation, a global drawing card in semiconductors for wired and radio communications, today announced a new ace-chipping HSPA (high-speed mailboat access) baseband central processor and a wireless frequency (RF) transceiver solution that integrates all of the key 3G (third multiplication) cellular and mobile technologies for powering the 3G smartphone and smart lineament earphone merchandise segments. The advanced baseband processor is the first to provide extremely high gear-speed cellular connectivity with advanced, built-in graphics capabilities, for HSUPA (high speed upstream mailboat access) applications. The RF transceiver solvent complements the advanced HSUPA central processor to provide documentation for all global frequency combinations covering the latest 3G-enabled devices.
Designed in Broadcom’s proven 65 nanometer CMOS process, the new ‘3G earphone-on-a-chip’ and RF solvent enables manufacturers to physique low cost, low might, next multiplication 3G HSUPA phones with breakthrough features, sleek form factors and very long assault and battery lives. Utilizing an integrated ARM11® central processor that is capable of run popular surface operating systems (such as Windows Mobile® and Android™), the Broadcom® BCM21553 HSUPA baseband central processor tin tally innovative new applications and download media files at a much faster speed, resulting in sophisticated and affordable handsets, and a more satisfying smartphone experience.
Highlights/Key Facts:
* Smartphones and smart featurephones continue to grow in popularity, with users attracted by the power to download and manipulation new software applications and survey rich multimedia system subject. Highlighting the ontogeny druthers to manipulation these phones for wirelessly accessing data, ABI Research projects over 350 petabytes of information volition be transferred exploitation smartphones in 2010, which is roughly equivalent weight to triad multiplication as much selective information as is contained in the Library of United States Congress.
* The Broadcom BCM21553 baseband central processor enables the next multiplication of smartphones by support 3GPP (3rd Generation Partnership Project) releases 6 and 7, which provide up to 5.8 Mbps (Megabits per second base) of upstream connectivity, 7.2 Mbps of downstream connectivity and support next multiplication CS (lap switches) over HSPA services.
o Includes Broadcom PRISM (programmable blocking suppression module) technology, which mitigates interference from radio signals emanating from neighboring cells, to provide higher execution gains in high gear blocking environments where they’re needed the most.
o Integrates a high gear execution 3D artwork inwardness with full documentation for the OpenGL® ES 2.0 graphics criterion, providing rich 2D and 3D artwork for applications and advanced drug user interfaces.
* Open operating organization (OS) support is a keystone prerequisite for today’s 3G smartphones, making these devices available to a broader range of software developers and innovative applications. By taking an Open OS approaching, phones based on Broadcom engineering can provide more mobile applications to users and an even bettor user experience.
o The BCM21553’s integrated high execution ARM11 central processor can support Windows Mobile River and Android surface operating systems, eliminating the need for an external applications central processor, which in turn saves size of it and cost, reduces system complexness, and improves assault and battery life for 3G handset devices.
* The powerful graphics core built into the BCM21553 baseband central processor is based on Broadcom’s advanced multimedia system technology, providing video documentation up to HVGA quality, an 8 megapixel camera, and the power to encode and decode H.264 video at 30 fps (frames per second base).
* Also introduced by the company today is the Broadcom BCM2091 wireless absolute frequency transceiver that provides RF connectivity for today’s announced BCM21553 HSUPA processor, enabling the industry’s smallest HSPA transceiver designed in a criterion first gear monetary value, 65nm CMOS procedure. The BCM2091 RF transceiver delivers the following:
o A highly flexible transceiver architecture that provides French telephone designers with ultimate tractability in PCB board design and reuse across the various cellular band and fashion configurations required worldwide
o Reduces external RF engine constituent reckoning by more than 40% over existing RF engines in production today, which in turn reduces pecker-of-materials (BoM) monetary value.
* The BCM21553 broadband central processor and the BCM2091 RF transceiver ar now available. Pricing is available upon petition.
o A fully proven and tested consultation designing, including other leadership Broadcom connectivity solutions (such as Bluetooth, WLAN, Global Positioning System and FM), volition also be provided.
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